Programmable Devices
CPLDs, FPGAs, SoC FPGAs, Configuration, and Transceivers
20703 Discussions

BGA Bake Requirements

Altera_Forum
Honored Contributor II
‎12-13-2010 04:00 PM
1,197 Views

We use a 256-FBGA Altera device on our product, which is in turn a surface-mount device. Should there be any requirement to bake our parts prior to our customer's reflow (is there any risk of moisture absorbtion by the BGA package once it has been mounted to our board)? 

 

:confused:
0 Kudos

Link Copied

1 Reply
Altera_Forum
Honored Contributor II
‎12-13-2010 05:21 PM
473 Views

The requirements are printed on the packing bags, if I remember right. Most Altera devices have one week floor lifetime (unpacking until needing baking). Moisture absorption of the mounted devices can be an issue, if board rework is required. Then the baking procedure applies to the board, I think.

0 Kudos
Copy link
Reply

Community support is provided during standard business hours (Monday to Friday 7AM - 5PM PST). Other contact methods are available here.

Intel does not verify all solutions, including but not limited to any file transfers that may appear in this community. Accordingly, Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or usage in trade.

For more complete information about compiler optimizations, see our Optimization Notice.