For some, the pandemic led to an unexpected opportunity to explore, grow and push boundaries. At Intel, a group of self-motivated collaborators from across multiple sites joined forces to explore their expertise and innovate – doing so virtually. Loosely connected at the beginning of the experience, these colleagues had only previously known each other through other channels such as Women at Intel Network (WIN), Society of Women Engineers (SWE) and cross functional projects.
Out of a desire to push their personal growth, a grassroots team was born: Priyanka Dobriyal from Memory and IO Group, Data Center AI; Ankur Agrawal from Silicon Photonics Product Division; Anna Prakash and Ann Xu from Global Supply Chain Operations; Abigail Agwai and Lesley Polka from Assembly & Test Technology Development (ATTD) in Architecture, Design and Technology Solutions (ADTS); Kayleen Helms from ATTD Core Competency; Raiyo Aspandiar from ATTD and Process Technology Development and one other contributor who has since left Intel.
Of their own accord, they brainstormed on problem statements they were seeing in their respective areas with an eye toward harvesting IPs. Lasers in silicon photonics was one opportunity area out of several on which the team brainstormed, with a particular challenge area and proposed solution creating a strong case for patent filing. The team submitted the Invention Disclosure: Underfill Keep Out Zone Creation Techniques for Laser region during Transmitter photonic IC Flip Chip Packaging.
Silicon photonics is an emerging technology and requires proven performance and reliability requirements, and the invention selected for patent filing is significant in this regard. Intel® Silicon Photonics products have been winning the market due to superior reliability. To offer even more advanced products, Intel requires advanced packaging solutions to meet customer demand. This solution enables such advanced packaging solutions, helping enable Intel’s continued dominance of the market.
This Invention Disclosure reflects many of Intel’s values, showcasing what is possible when employees from diverse backgrounds rally together to problem solve and ensure the company’s leadership in technological advancement. The experience proved not only successful, but richly rewarding to those who participated. From leveraging a diversity of ideas to connecting and having fun while driving technology forward, each collaborator grew personally and professionally and all are looking forward to contributing more in the future.